flat panel equipment, laser scanning, dielectric films, dual lasers, autocalibration, surface topography
FSM is a major semiconductor equipment manufacturer who pioneered in the optical lever (optilever) TM laser scanning technique for measuring stress and flatness in deposited thin film in wafers.
Our metrology tool is used widely by wafer fabs in production as well as in R&D facilities worldwide, for monitoring stress related reliability issues in thin films. These include metal and dielectric film cracking, hillock formation, voiding and lifting.
For material characterization for low k dielectric and copper, our multiprobe vacuum annealing system (with RTP type chamber) can simultaneously provide data on stress, thermal desorption, film thickness, reflectivity ,and resistivity changes as a function of temperature, up to 1100 deg. C . To evaluate material properties and integration issues of low k and copper, a quantitative adhesion tester is available.
Because of its non destructive technique and the ability to measure large surface areas for 3D topographic changes, the FSM Stress and Flatness Gauge played an important role in the industry's latest 300mm Wafer Initiative as well as the emerging Flat Planel Display (FPD) industry.
For wafer backgrinding applications, including Smart Card and GaAs applications, systems are available to measure wafer substrate thickness, bow and warp.
FSM also provides solution to upgrade existing metrology and process tools to be ergonomically complaint, through a unique cassette rotator /flipper.