Analysis

Yole explores the power electronics industry

6th February 2015
Nat Bowers
0

According to Yole Développement, Wide Band Gap (WBG) technologies are almost ready to be used by power electronics integrators. The question is how? Industry players have identified many module packaging challenges. Yole has analysed their insights, and is now presenting an overview of the issues.

Dr Pierric Gueguen, Business Unit Manager, Power Electronics, Yole Développement, comments: “The expected rebound from EV/HEV applications and the emergence of smart-grid projects did not occur in 2013. Indeed, the car market was still depressed and the industry segment not strong enough to sustain high volumes.” But how will EV/HEV applications impact the power electronics industry in 2015?

And what about Chinese players? Over the last few years, their leadership has been confirmed among their local markets. According to Yole’s analysis, these companies are now looking for international business opportunities. Such a strategy could reinforce their positioning and strongly modify the supply chain.

The power electronics industry has been focusing its research and development on WBG technologies. Under this strategy, SiC and GaN have proved to be powerful solutions. They are now ready to be implemented in numerous power electronics applications.

Most companies today choose SiC technologies for high temperature and high voltage applications. Yole confirms that SiC is propagating across all industrial segments. Contagion has begun. In parallel, companies are developing GaN solutions for medium-voltage applications, especially GaN HEMT transistors.

However, Yole’s analysts have identified a potential bottleneck for WBG technologies’ adoption: device integration, especially at the power module packaging level. “WBG market shares are not directly linked to WBG component availability,” highlights Pierric. Instead they depend on when integrators will get benefits from such solutions. New WBG-based solutions induce research expenses at the power module packaging level. Such costs must be compensated for by added value at the system, compare to existing silicon solutions. “Integrators could ensure such added value by integrating WBG devices with an increased operating frequency and temperature," explains Pierric.

Yole explores the power electronics industry

Yole will present its latest analysis at the Applied Power Electronics Conference (15th to 19th March in North Carolina). Yole’s presentation includes the following topics: the power electronics industry’s market structure; the status of its innovations; business opportunities at the substrate and device level as well as from the applications side.

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