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Broadcom Assigned Patent for Integrated Circuit Substrate Manufacture
[July 22, 2014]

Broadcom Assigned Patent for Integrated Circuit Substrate Manufacture


(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., July 22 -- Broadcom, Irvine, California, has been assigned a patent (8,779,598) developed by three co-inventors for a method and apparatuses "for integrated circuit substrate manufacture." The co-inventors are Fan Yeung, Irvine, California, Raymond (Kwok Cheung) Tsang, Irvine, California, and Edward Law, Ladera Ranch, California.



The patent application was filed on June 28, 2011 (13/170,820). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8779598.PN.&OS=PN/8779598&RS=PN/8779598 Written by Jude Bautista, edited by Vessie Ann Abalos.

30BautistaJude 140722-1038759 (c) 2014 Targeted News Service

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